This inventor holds 1 USPTO granted patent. Top assignee: Lsi Logic Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Innovations of Yoshifumi Sakuma
Introduction
Yoshifumi Sakuma is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of chemical-mechanical polishing, particularly in the context of integrated circuit substrates. His innovative methods have paved the way for advancements in semiconductor manufacturing.
Latest Patents
Yoshifumi Sakuma holds a patent for a "Method and apparatus for chemical-mechanical polishing." This patent describes a method for polishing a layer deposited on the surface of an integrated circuit substrate. The process involves immobilizing the substrate using a holder, followed by a two-stage polishing process that ensures a substantially planar substrate surface. He has 1 patent to his name.
Career Highlights
Sakuma is currently associated with LSI Logic Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of chemical-mechanical polishing techniques.
Collaborations
Throughout his career, Yoshifumi Sakuma has collaborated with esteemed colleagues such as Hiroshi Mizuno and Tetsuaki Murohashi. These collaborations have further enriched his contributions to the field.
Conclusion
Yoshifumi Sakuma's innovative methods in chemical-mechanical polishing have significantly impacted the semiconductor industry. His dedication to advancing technology continues to inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile