Suwon, South Korea

Yoong Chung

This inventor holds 1 USPTO granted patent. Top assignees: Samsung Electronics Co., Ltd., Technical Coating Solution Line-X Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoong Chung. Retrieved from https://idiyas.com/inventor/yoong-chung-2owfapbi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yoong Chung: Inventor of an Advanced Insulation Structure

Introduction

Yoong Chung is an inventor based in Suwon, South Korea. His patent work includes an insulation structure designed for pipes and insulated piping devices. Chung is associated with Samsung Electronics Co., Ltd. and Technical Coating Solution Line-X Co., Ltd.

Latest Patents

Chung is named on 1 patent: “Insulation Structure, Insulated Piping Device Including the Same, and Method of Fabricating the Same.” The invention describes a layered insulation structure placed around a pipe. Its first layer sits on the pipe’s outer surface, while a second layer made from a different material covers the first. A third layer, made from a material different from the second, covers the second layer. The second layer is thicker than both the first and third layers and includes porous foam. The patent also covers insulated piping devices incorporating the structure and methods for fabricating it.

Career Highlights

Chung’s listed company affiliations include Samsung Electronics Co., Ltd. and Technical Coating Solution Line-X Co., Ltd. His patent focuses on a multilayer approach to pipe insulation, with the thicker porous-foam layer forming a central part of the design.

Collaborations

Chung’s listed coworkers include Injun Choi and Saya Lee.

Conclusion

Yoong Chung’s patent documents a layered pipe-insulation design that combines different materials and a thicker porous-foam layer in an insulated piping structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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