The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jul. 13, 2022
Insulation structure, insulated piping device including the same, and method of fabricating the same
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongwan Kim, Suwon-si, KR;
Jeong-Hyun Kim, Pyeongtaek-si, KR;
Seung-Hyeok An, Hwaseong-si, KR;
Saya Lee, Osan-si, KR;
Yoong Chung, Suwon-si, KR;
Jiho Jeon, Yeosu-si, KR;
Yongjun Cho, Pyeongtaek-si, KR;
Injun Choi, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
TECHNICAL COATING SOLUTION LINE-X CO., LTD., Hwaseong-si, KR;
Abstract
Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.