Yoo Sun Kim

Title: Yoo Sun Kim: Innovator in Flexible Device Technology

Introduction

Yoo Sun Kim is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of flexible device technology, holding a total of 2 patents. His innovative work focuses on methods for packaging flexible devices and bonding flexible printed circuit boards (PCBs) to camera modules.

Latest Patents

Yoo Sun Kim's latest patents include a "Method for packaging flexible device using holding wafer" and a "Device for bonding flexible PCB to camera module." The first patent provides a flexible device that consists of a flexible substrate, electrode lines, an anisotropic conductive film, bumps, and a circuit board with an electronic device. The second patent discloses a device that bonds a flexible PCB to a camera module using a thermo-compression unit and an ultrasonic wave bonding unit, ensuring a reliable connection.

Career Highlights

Throughout his career, Yoo Sun Kim has worked with esteemed organizations such as the Korea Advanced Institute of Science and Technology and LG Innotek Co., Ltd. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in flexible device technology.

Collaborations

Yoo Sun Kim has collaborated with notable colleagues, including Jae Chun Lee and Kyuong-wook Paik. These partnerships have fostered a creative environment that has led to innovative solutions in the field.

Conclusion

Yoo Sun Kim's contributions to flexible device technology are noteworthy, with his patents reflecting his expertise and innovative spirit. His work continues to influence advancements in the industry, showcasing the importance of creativity and collaboration in technological development.