Korea Advanced Institute of Science and Technology

Lg Innotek Co., Ltd.

Yoo Sun Kim

Keon Jae Lee

Do Hyun Kim

Kiwon Lee

Jae Chun Lee

Geon Tae Hwang

Kyung Wook Baek

Hyeon Kyun Yoo

Kyuong-wook Paik

Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.

Method for packaging flexible device using holding wafer, and flexible device manufactured by the same

Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.

Device for bonding flexible PCB to camera module

Growing community of inventors

Daejeon, South Korea

Yoo Sun Kim