This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Sunlord Electronics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Yongming He: Innovator in Surface-Mounted Transformer Technology
Introduction
Yongming He is a notable inventor based in Guangdong, China. He has made significant contributions to the field of electronics, particularly in the development of surface-mounted transformers. His innovative approach has led to advancements that enhance the reliability and efficiency of electronic components.
Latest Patents
Yongming He holds a patent for a surface-mounted transformer and its processing method. This transformer features an adhesive layer and a winding product, which includes an I-shaped magnetic core and a coil wound around its middle pillar. The leading-out ends of the coil are connected to electrodes that are exposed on the surface of the adhesive layer. This design allows for a smaller size, with a decrease proportion of over 50% compared to prior art transformers with equal performance indexes. Additionally, the winding product is completely covered by the adhesive layer, enhancing the product's reliability and suitability for a PSIP plastic package environment.
Career Highlights
Yongming He is associated with Shenzhen Sunlord Electronics Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in pushing the boundaries of transformer technology, making significant strides in miniaturization and reliability.
Collaborations
Yongming He collaborates with talented individuals such as Deping Zeng and Hui Lin. Their combined expertise contributes to the advancement of technology within their organization.
Conclusion
Yongming He is a prominent figure in the field of electronics, particularly known for his innovative surface-mounted transformer technology. His contributions have not only improved product reliability but also reduced the size of electronic components significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile