The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Nov. 16, 2021
Applicant:

Shenzhen Sunlord Electronics Co., Ltd., Guangdong, CN;

Inventors:

Deping Zeng, Guangdong, CN;

Hui Lin, Guangdong, CN;

Xiaohu Tang, Guangdong, CN;

Qunsheng Zhou, Guangdong, CN;

Wei Xie, Guangdong, CN;

Yongming He, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 1/34 (2006.01); H01F 27/255 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 1/344 (2013.01); H01F 27/255 (2013.01); H01F 41/0246 (2013.01); H01F 41/04 (2013.01);
Abstract

A surface-mounted transformer includes an adhesive layer and a winding product. The winding product is disposed inside the adhesive layer; the winding product includes an I-shaped magnetic core and a coil wound on a middle pillar of the I-shaped magnetic core; leading-out ends of the coil are connected to electrodes; the electrodes are exposed on the surface of the adhesive layer; and the adhesive layer is obtained through compression molding forming of a magnetic molding material. Compared with a surface-mounted transformer in the prior art, which has equal performance indexes, the surface-mounted transformer has a smaller size with a decrease proportion of over 50%; and a BOBBIN and an insulating rubber tape do not need to be used in processing. The winding product in the surface-mounted transformer is completely covered by the adhesive layer, so that the product is high in reliability and can support a PSIP plastic package environment.


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