Location History:
- Qingyuan, CN (2015)
- Guangdong, CN (2014 - 2016)
- Dongguan, CN (2023)
Company Filing History:
Years Active: 2014-2025
Title: Innovations of Inventor Hui Lin
Introduction
Hui Lin is a notable inventor based in Guangdong, China. He has made significant contributions to the field of technology, particularly in the development of advanced electronic components. With a total of 6 patents to his name, his work reflects a commitment to innovation and improvement in electronic design.
Latest Patents
Hui Lin's latest patents include a surface-mounted transformer and processing method. This innovative transformer features an adhesive layer and a winding product, which includes an I-shaped magnetic core and a coil wound on the middle pillar of the core. The design allows for a smaller size compared to traditional surface-mounted transformers, achieving a decrease in size by over 50%. Additionally, the winding product is completely covered by the adhesive layer, enhancing reliability and suitability for a PSIP plastic package environment. Another significant patent involves a capability parameter determining method, uplink scheduling method, terminal, and network-side device. This invention focuses on optimizing the connection link of a terminal, improving the efficiency of uplink communication.
Career Highlights
Throughout his career, Hui Lin has worked with prominent companies such as Gadmei Electronics Technology Co., Ltd. and Vivo Mobile Communication Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various technological advancements.
Collaborations
Hui Lin has collaborated with talented individuals in the industry, including Zhihua Zhang and Yuanping Yao. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Hui Lin's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the development of electronic components, showcasing the importance of innovation in driving progress.