This inventor holds 15 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2022-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2026
Areas of Expertise:
Title: Yongkoon Lee: Innovator in Semiconductor Packaging
Introduction
Yongkoon Lee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 12 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.
Latest Patents
Among his latest patents, Yongkoon Lee has developed a semiconductor package that includes an antenna structure. This structure is designed to transmit and receive signals through a dielectric layer. The package features a connection via extending from the antenna member, a ground member, and a frame that surrounds the antenna structure. Additionally, it includes a first encapsulant covering part of the antenna structure and a redistribution structure that connects the semiconductor chip to the antenna member. Another notable patent involves a semiconductor package that incorporates a supporting wiring structure, a frame with a mounting space, and a cover wiring structure that includes an antenna structure. These innovations demonstrate his commitment to advancing semiconductor technology.
Career Highlights
Yongkoon Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor packaging technology. His work has been instrumental in developing solutions that meet the growing demands of modern electronics.
Collaborations
Throughout his career, Yongkoon Lee has collaborated with talented individuals such as Sangkyu Lee and Jingu Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Yongkoon Lee's contributions to semiconductor packaging are noteworthy and reflect his expertise in the field. His innovative patents and collaborations with colleagues highlight his role as a leading inventor in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile