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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12040248 B1

PDFFull Text
Date of Patent:
Jul. 16, 2024

Filed:

Jan. 20, 2023

Semiconductor package including heat spreader layer

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jingu Kim, Suwon-si, KR;

Sangkyu Lee, Suwon-si, KR;

Yongkoon Lee, Suwon-si, KR;

Seokkyu Choi, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Neil R Prasad

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 2224/214 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01);
Abstract

A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

Find Patent Forward Citations

Kim, Jingu. (2024). Semiconductor package including heat spreader layer (U.S. Patent No. 12040248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12040248

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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