YongJin Jeong

Title: YongJin Jeong: Innovator in Semiconductor Technology

Introduction

YongJin Jeong is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

YongJin Jeong holds a patent for a semiconductor device and method for reducing metal burrs using laser grooving. This invention involves the formation of a semiconductor device using a jig that includes a metal frame, a polymer film, and an adhesive layer. An opening is created through the adhesive layer and polymer film, with a groove formed around the opening. A semiconductor package is placed on the jig over the opening, ensuring that a side surface of the package is adjacent to the groove. A shielding layer is then formed over both the semiconductor package and the jig, allowing for the removal of the semiconductor package from the jig.

Career Highlights

YongJin Jeong is currently employed at Stats Chippac Pte. Ltd., where he continues to advance his work in semiconductor technology. His expertise and innovative approach have positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, YongJin has collaborated with notable colleagues, including ChangOh Kim and Jinhee Jung. These partnerships have fostered a collaborative environment that enhances innovation and development in their projects.

Conclusion

YongJin Jeong's contributions to semiconductor technology through his patent demonstrate his commitment to innovation and excellence in the field. His work continues to influence advancements in semiconductor devices, showcasing the importance of creativity and collaboration in technology development.