Yonghyun Kim

Title: Yonghyun Kim and Semiconductor Packaging Innovation.

Introduction

Yonghyun Kim is an inventor based in Anyang-si, South Korea, associated with Samsung Electronics Ltd. His work includes a patent for semiconductor packaging technology. The available information lists 1 patent.

Latest Patents

Kim’s listed patent is “Semiconductor Package Structure Having Interposer Substrate, and Stacked Semiconductor Package Structure Including the Same.” It describes a semiconductor chip mounted on a package substrate, with an interposer substrate positioned over the chip and supported by connection bumps. A support structure between the package substrate and interposer includes a metal core ball surrounded by a ball-cover layer. The layer’s thickness gradually decreases in cross-section from the interposer toward the package substrate.

Career Highlights

The patent reflects work on the structural design of semiconductor packages, including how an interposer is connected to and supported above a package substrate. The described arrangement combines electrical connections with a separate support structure.

Collaborations

The provided information names Sunchul Kim and Seunghwan Baek as Kim’s coworkers. It does not specify their roles in the patent or whether they collaborated on it.

Conclusion

Yonghyun Kim’s listed patent focuses on an interposer-based semiconductor package and a support structure designed to connect and stabilize its components.