This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yongchul Shin - Innovator in Semiconductor and Safety Technology
Introduction
Yongchul Shin is an inventor based in Suwon-si, South Korea. He has made significant contributions to the fields of semiconductor packaging and safety technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Yongchul Shin's recent patent applications include a "Manufacturing Method of Semiconductor Package." This method involves bonding a carrier to a wafer, dicing the wafer along with the carrier into multiple die-carrier assemblies, and disposing of these assemblies on a target substrate. The process also includes separating the carrier pieces from the assemblies by irradiating them with light. Another notable application is for a "Combination Structure of Safety Vest and Safety Belt for Vehicle Seat." This design integrates a safety vest with a safety belt, enhancing safety and convenience without the need for additional conversion means.
Conclusion
Yongchul Shin's innovative approaches in semiconductor packaging and safety technology showcase his potential as an inventor. His latest patent applications reflect a commitment to improving safety and efficiency in these fields.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile