The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 29, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongchul Shin, Suwon-si, KR;
Minwoo Rhee, Suwon-si, KR;
Sujie Kang, Suwon-si, KR;
Sun-Woo Park, Suwon-si, KR;
Nungpyo Hong, Suwon-si, KR;
Kyeongbin Lim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile