This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sun-woo Park: Innovator in Semiconductor Package Manufacturing
Introduction
Sun-woo Park is an inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging. His innovative approach focuses on improving manufacturing methods for semiconductor packages.
Latest Patent Applications
Sun-woo Park has filed a patent application titled "Manufacturing Method of Semiconductor Package." This application outlines a method that includes bonding a carrier to a wafer, dicing the wafer along with the carrier into multiple die-carrier assemblies, and disposing of these assemblies on a target substrate. The process also involves separating the carrier pieces from the assemblies by irradiating them with light.
Conclusion
Sun-woo Park's work in semiconductor package manufacturing showcases his commitment to innovation in the technology sector. His patent application reflects a forward-thinking approach that could influence future developments in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile