This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Yongchang Lim: Innovator in Multi-Layer Encapsulation Technology
Introduction
Yongchang Lim is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of encapsulation technology, particularly through his innovative patent. His work focuses on improving the performance and durability of electronic devices.
Latest Patents
Yongchang Lim holds a patent for a multi-layer encapsulating film that comprises a planarizing organic thin layer and a conformal organic thin layer. This invention includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in specific orders to enhance surface roughness and ensure uniform coverage of particles on devices. This technology is crucial for advancing the reliability of electronic components.
Career Highlights
Yongchang Lim is currently employed at Applied Materials, Inc., where he continues to develop innovative solutions in the field of materials science. His expertise in thin film technology has positioned him as a key player in the industry.
Collaborations
He has collaborated with notable colleagues, including Sangcheol Nam and Hoyoung Park, to further enhance the research and development of encapsulation technologies.
Conclusion
Yongchang Lim's contributions to multi-layer encapsulation technology demonstrate his commitment to innovation in the electronics field. His patent reflects a significant advancement that can lead to improved device performance and longevity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile