The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Apr. 03, 2008
Sangcheol Nam, Seoul, KR;
Hoyoung Park, Seoul, KR;
Yongchang Lim, Seoul, KR;
Kichang Lee, Seoul, KR;
Kyugil Choi, Seoul, KR;
Hosung Hwang, Yongin-si, KR;
Giback Park, Bucheon-si, KR;
Jimin Kim, Seoul, KR;
Sangcheol Nam, Seoul, KR;
Hoyoung Park, Seoul, KR;
Yongchang Lim, Seoul, KR;
Kichang Lee, Seoul, KR;
Kyugil Choi, Seoul, KR;
Hosung Hwang, Yongin-si, KR;
Giback Park, Bucheon-si, KR;
Jimin Kim, Seoul, KR;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A multi layer encapsulating film includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in order of (a) a planarizing organic thin film, an inorganic thin film, a conformal organic thin film, and an inorganic thin film, (b) a conformal organic thin film, an inorganic thin film, a planarizing organic thin film, and an inorganic thin film, (c) a planarizing organic thin film, a conformal organic thin film, and an inorganic thin film, or (d) a conformal organic thin film, a planarizing organic thin film, and an inorganic thin film. The multi layer encapsulating film according to the invention can improve the surface roughness by using the planarizing organic thin film, and can enable particles to uniformly cover the device by using the conformal organic thin film.