Seoul, South Korea

Kichang Lee

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kichang Lee. Retrieved from https://idiyas.com/inventor/kichang-lee-e5ysg843

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Kichang Lee: Innovator in Multi-Layer Encapsulation Technology

Introduction

Kichang Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of encapsulation technology, particularly through his innovative patent. His work focuses on improving the performance and reliability of electronic devices.

Latest Patents

Kichang Lee holds a patent for a multi-layer encapsulating film that comprises a planarizing organic thin layer and a conformal organic thin layer. This invention includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in specific orders to enhance surface roughness and ensure uniform coverage of particles on devices. This technology is crucial for advancing the durability and efficiency of electronic components.

Career Highlights

Kichang Lee is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His role involves developing advanced materials that contribute to the manufacturing of high-performance electronic devices. His expertise and innovative approach have positioned him as a key figure in his field.

Collaborations

Kichang Lee has collaborated with notable colleagues, including Kyugil Choi and Sangcheol Nam. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Kichang Lee's contributions to multi-layer encapsulation technology exemplify his commitment to innovation in the electronics industry. His patent and work at Applied Materials, Inc. highlight his role as a leading inventor in this vital field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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