Plano, TX, United States of America

Yong Xie

This inventor holds 7 USPTO granted patents and 4 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Xie. Retrieved from https://idiyas.com/inventor/yong-xie-homomusm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7 

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 2012-2025

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7 patents (USPTO):Explore Patents

Title: Yong Xie - Innovator in Circuit Protection and Interconnect Structures

Introduction

Yong Xie is a prominent inventor based in Plano, TX, known for his contributions to circuit protection and interconnect technologies. With a total of 7 patents to his name, he has made significant advancements in the field of electronics.

Latest Patents

Yong Xie's latest patents include innovative designs that enhance the reliability and efficiency of electronic circuits. One of his notable inventions is a transistor short circuit protection system. This system features a short circuit detection circuit that includes a current terminal, a sense resistor, an amplifier, and a resistor-capacitor ladder. The sense resistor is coupled to the current terminal and is configured to develop a sense voltage proportional to the current through the terminal. The amplifier generates a scaled current proportional to the sense voltage, while the resistor-capacitor ladder produces a measurement voltage that represents a surface temperature rise due to the current.

Another significant patent is for an interconnect structure for high power GaN modules. This invention includes a printed planar interconnect line and a method for making the same. In this design, a multilayer substrate has a conductive pad formed on its surface. An integrated circuit (IC) die is bonded to the substrate in a dead bug manner, exposing a set of bond pads on the IC die. A planar interconnect line formed by printed ink connects these bond pads to the conductive pad.

Career Highlights

Yong Xie is currently employed at Texas Instruments Corporation, where he continues to innovate and develop cutting-edge technologies. His work has significantly impacted the field of electronics, particularly in enhancing circuit protection and interconnect designs.

Collaborations

Yong has collaborated with notable colleagues, including Cetin Kaya and Nathan Richard Schemm, contributing to various projects and advancements in their field.

Conclusion

Yong Xie's contributions to circuit protection and interconnect structures demonstrate his commitment to innovation in electronics. His patents reflect a deep understanding of the challenges in the industry and a dedication to developing effective solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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