Yong Rae Roh

Title: Yong Rae Roh: Innovator in Ultrasonic Technology

Introduction

Yong Rae Roh is a prominent inventor based in Daegu, South Korea. He has made significant contributions to the field of ultrasonic technology, holding a total of 2 patents. His work focuses on innovative methods and devices that enhance the functionality and efficiency of ultrasonic probes.

Latest Patents

Yong Rae Roh's latest patents include a jig and a manufacturing method thereof, as well as a flip chip bonding method for chips of ultrasound probes using a jig. The jig comprises a wafer with an accommodation groove designed to hold a capacitive micromachined ultrasonic transducer (cMUT) during the flip chip bonding process. Additionally, it features a separation groove on the bottom surface of the accommodation groove, which is strategically spaced from the thin films of the cMUT. This design ensures optimal seating of the cMUT on the bottom surface of the accommodation groove, enhancing the bonding process.

Career Highlights

Throughout his career, Yong Rae Roh has worked with notable organizations, including Samsung Electronics Co., Ltd. and the Kyungpook National University Industry-Academic Cooperation Foundation. His experience in these institutions has allowed him to develop and refine his innovative ideas in ultrasonic technology.

Collaborations

Yong Rae Roh has collaborated with several professionals in his field, including Young Il Kim and Bae Hyung Kim. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Yong Rae Roh is a distinguished inventor whose work in ultrasonic technology has led to significant advancements in the field. His innovative patents and collaborations reflect his commitment to enhancing the capabilities of ultrasonic devices.