The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jan. 28, 2015
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyungpook National University Industry-academic Cooperation Foundation, Daegu, KR;
Young Il Kim, Suwon-si, KR;
Bae Hyung Kim, Yongin-si, KR;
Jong Keun Song, Yongin-si, KR;
Seung Heun Lee, Seoul, KR;
Kyung Il Cho, Seoul, KR;
Yong Rae Roh, Daegu, KR;
Won Seok Lee, Daegu, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Kyungpook National University Industry-Academic Cooperation Foundation, Daegu, KR;
Abstract
A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.