Gyunggi-do, South Korea

Yong Hoon Kwak

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Hoon Kwak. Retrieved from https://idiyas.com/inventor/yong-hoon-kwak

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Yong Hoon Kwak: Innovator in Power Module Technology

Introduction

Yong Hoon Kwak is a notable inventor based in Gyunggi-do, South Korea. He has made significant contributions to the field of power module technology. His innovative work has led to the development of a unique power module package that enhances the efficiency and performance of electronic devices.

Latest Patents

Yong Hoon Kwak holds a patent for a power module package. This invention includes a substrate with a ceramic layer on one surface, a circuit pattern on the ceramic layer, a first lead frame that contacts the circuit pattern, and a first semiconductor chip mounted on the lead frame. This design aims to improve the functionality and reliability of power modules in various applications.

Career Highlights

Kwak is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the advancement of electronic components.

Collaborations

Some of his coworkers include Kyu Hwan Oh and Young Ki Lee. Their collaboration has fostered an environment of innovation and creativity within the team.

Conclusion

Yong Hoon Kwak's contributions to power module technology exemplify the spirit of innovation in the electronics field. His patent and work at Samsung Electro-Mechanics Co., Ltd. highlight his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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