The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Sep. 11, 2012
Applicants:

Kwang Soo Kim, Gyunggi-do, KR;

Yong Hoon Kwak, Gyunggi-do, KR;

Sun Woo Yun, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Kyu Hwan OH, Gyunggi-do, KR;

Jin Suk Son, Gyunggi-do, KR;

Inventors:

Kwang Soo Kim, Gyunggi-do, KR;

Yong Hoon Kwak, Gyunggi-do, KR;

Sun Woo Yun, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Kyu Hwan Oh, Gyunggi-do, KR;

Jin Suk Son, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.


Find Patent Forward Citations

Loading…