Company Filing History:
Years Active: 2017-2024
Title: Yong Han: Innovator in Liquid Cooling and Semiconductor Technologies
Introduction
Yong Han is a prominent inventor based in Singapore, known for his contributions to liquid cooling modules and semiconductor packaging technologies. With a total of six patents to his name, he has made significant advancements in the field of electronics cooling and packaging.
Latest Patents
Yong Han's latest patents include a liquid cooling module and a semiconductor package. The liquid cooling module features a main body that incorporates a cooling core with a microfluidic structure designed to carry a cooling liquid. This innovative design also includes a sealing pad for efficient heat transfer from electronic devices to the cooling core, along with multiple fins that contain internal circulating liquid ducts. His semiconductor package patent describes a structure that includes a semiconductor chip, mold compound layers, and a redistribution layer with electrically conductive lines, culminating in an antenna array for enhanced connectivity.
Career Highlights
Throughout his career, Yong Han has worked with notable organizations such as the Agency for Science, Technology and Research and Schneider Electric Logistics Asia Pte Ltd. His experience in these companies has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics sector.
Collaborations
Yong Han has collaborated with talented individuals in his field, including Boon Long Lau and Liew Yew Loung. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Yong Han's work in liquid cooling and semiconductor technologies showcases his dedication to innovation and excellence. His patents reflect a commitment to advancing electronic device performance and efficiency.