Agency for Science, Technology and Research

Schneider Electric Logistics Asia Pte Ltd.

Schneider Electric Industries Sas

Yong Han

Liew Yew Loung

Boon Long Lau

Xiaowu Zhang

Ka Fai Chang

Ya Chee Yeong

Wong Yoon Nam

Pan Yi Jun

Gongyue Tang

Daniel Minwo Rhee

Rey-Anthony Carullo

Chong Pat Jong

David Soon Wee Ho

Quek Kee Meng

Ying Ying Lim

Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

Liquid cooling module and method of forming the same

Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.

Semiconductor package and method of forming the same

According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

Heat sinks and methods for fabricating a heat sink

A method and relay for communicating a value of a parameter of a source to be monitored. The relay comprises an input sampling module for coupling to the source to be monitored, the sampling module configured to detect the value of a parameter of the source to be monitored; and an output module for communicating the value to a user.

Method and relay for communicating a value of a parameter of a source to be monitored

A switching device and a method for switching states of a switching device are provided, the switching device comprising a housing; a switching module comprising a switching element, the switching module is configured to switch a state of the switching element upon generation of a switching signal; and an actuator for receiving a mechanical input and for facilitating generation of an electrical toggle signal, the toggle signal for causing the switching module to switch a state of the switching element.

Actuator for a switching device

A method and a device for counting energization events. The device comprises a connector member for connecting to an energizable element; a sampling module coupled to the connector member, the sampling module configured to detect energization of the energizable element; a count module coupled to the sampling module, the count module configured to count a number of detected energization events of the energizable element.

Method and device for counting energisation events

Growing community of inventors

Singapore, Singapore

Yong Han