Yong Ghen

Title: Yong Ghen - Innovator in Bonding Technology

Introduction

Yong Ghen is a notable inventor based in Suzhou, China. He has made significant contributions to the field of bonding technology, particularly through his innovative patent.

Latest Patents

Yong Ghen holds a patent for a bonding apparatus and bonding method. This apparatus is equipped with a control unit that can manage the position of the central axis of a bonding tool in both the X and Y directions. It utilizes an image of a pad captured by a camera, along with an offset amount. The apparatus includes an outline obtaining unit that processes the image to obtain the sides of the pad and the outline of a pressure-bonded ball. Additionally, it features a gap length obtaining unit that measures the gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball. Finally, an offset correcting unit adjusts the offset amount based on the gap lengths obtained.

Career Highlights

Yong Ghen has dedicated his career to advancing bonding technology. His innovative approach has led to the development of efficient bonding methods that enhance the precision and reliability of bonding processes.

Collaborations

Yong Ghen collaborates with Kenji Sugawara, a fellow innovator in the field. Their partnership has fostered the exchange of ideas and has contributed to the advancement of bonding technologies.

Conclusion

Yong Ghen's contributions to bonding technology through his patent demonstrate his commitment to innovation and excellence in his field. His work continues to influence the industry and pave the way for future advancements.