Company Filing History:
2 out of 48 
1 out of 69 Years Active: 2015-2016
Title: Yong Bo Yang: Innovator in Semiconductor Packaging Technology
Introduction
Yong Bo Yang is a prominent inventor based in Singapore, known for his contributions to semiconductor packaging technology. With a total of 3 patents, he has made significant advancements in the field, particularly in leadframe area array packaging.
Latest Patents
One of his latest patents focuses on leadframe area array packaging technology. This invention involves fabricating an area array of I/O contacts, utilizing a polymer material substrate and an interconnect layer. The design includes a die coupled to the interconnect layer via wire bonds or conductive pillars, all encapsulated in a molding compound. The polymer substrate features through holes that expose the interconnect layer, allowing for solder ball mounting directly to it. Additionally, the semiconductor package may include a relief channel in the substrate to enhance reliability.
Another notable patent by Yang presents methods for forming semiconductor packages. This method involves a package substrate with cavities and an interconnect structure. Conductive studs are formed within the cavities, and a die with conductive contacts is coupled to the interconnect structure. A cap is then formed over the substrate to encapsulate the die, ensuring a robust package design.
Career Highlights
Yong Bo Yang has worked with several notable companies in the semiconductor industry, including United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.
Collaborations
Throughout his career, Yang has collaborated with various professionals, including Antonio Bambalan Dimaano, Jr. and Nathapong Suthiwongsunthorn. These collaborations have further enriched his work and innovations in the field.
Conclusion
Yong Bo Yang's contributions to semiconductor packaging technology have established him as a key figure in the industry. His innovative patents and career achievements reflect his dedication to advancing technology in this critical area.