Company Filing History:
Years Active: 1998-2000
Title: Yong Bai Son: Innovator in Nitride Surface Modification and Thermal Shock-Resistant Materials
Introduction
Yong Bai Son is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of materials science, particularly in the modification of nitride surfaces and the development of thermal shock-resistant materials. With a total of 2 patents, his work has implications for various industrial applications.
Latest Patents
Yong Bai Son's latest patents include a process for modifying surfaces of nitride and a thermal shock-resistant alumina-mullite composite material. The first patent describes a method that involves irradiating energized ion particles onto a nitride surface while blowing a reactive gas directly onto the surface under vacuum conditions. This innovative process allows for the creation of aluminum nitride suitable for direct bond copper (DBC) applications. The second patent focuses on a thermal shock-resistant alumina-mullite composite material, which is designed to maintain compactness while facilitating mullite formation. This material can withstand temperatures up to 300°C, making it ideal for applications subject to wide thermal variations.
Career Highlights
Yong Bai Son is affiliated with the Korea Institute of Science and Technology, where he conducts research and development in advanced materials. His expertise in nitride surface modification and thermal shock-resistant materials has positioned him as a key figure in his field.
Collaborations
Some of his notable coworkers include In-Jae Jung and Sang-woo Kim, who have collaborated with him on various research projects. Their combined efforts contribute to the advancement of materials science and engineering.
Conclusion
Yong Bai Son's innovative work in nitride surface modification and thermal shock-resistant materials showcases his significant impact on materials science. His patents reflect a commitment to advancing technology and improving industrial applications.