Korea Institute of Science and Technology

Yong Bai Son

Hyung Jin Jung

Sang-woo Kim

Won Kook Choi

Seok Keun Koh

In-Jae Jung

A process for modifying a nitride surface includes irradiating energized ion particles onto the nitride surface while blowing a reactive gas directly on the nitride surface under a vacuum condition. An aluminum nitride for a direct bond copper (DBC) can be obtained by forming a thin copper film on the thusly modified nitride.

Process for modifying surfaces of nitride, and nitride having surfaces

A thermal shock-resistant alumina-mullite composite material and a preparation method thereof which are capable of concurrently obtaining the compactness of the material and a mullite formation. The material is comprised of 4.about.30 weight % of one aluminum silicate selected from the group consisting of kaolinite, silimanite, and kyanite, 75.about.94 weight % of Al.sub.2 O.sub.3 based on the total amount of Al.sub.2 O.sub.3, and 0.5.about.6 weight % of an alkaline earth metal oxide, wherein the weight ratio of the alkaline earth metal oxide to SiO.sub.2 is 1:2.about.1:3. The composition is first sintered at a temperature of 1450.degree..about.1650.degree. C. for 1.about.5 hours, then cooled down to 1000.degree. C., and then crystallized at a temperature of 1200.degree..about.1500.degree. C. for 1.about.20 hours. This composition is usable to a maximum temperature 300.degree. C. as indicated theraml- shock-resistant testing, and is well application to a part subject to wide thermal variation and for which a conventional 85%.about.96% alumina material is not usable.

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Seoul, South Korea

Yong Bai Son