Yoko Nishiwaki

Title: Yoko Nishiwaki: Innovator in Multilayer Printed Wiring Board Technology

Introduction

Yoko Nishiwaki is a prominent inventor based in Gifu, Japan. He is known for his significant contributions to the field of printed wiring board technology. His innovative approach has led to advancements that enhance the performance and reliability of electronic components.

Latest Patents

Yoko Nishiwaki holds a patent for a multilayer printed wiring board that features a roughened inner conductor layer and a unique production method. This invention involves a multilayer structure where conductor circuit patterns are formed on a core substrate through interlaminar resin insulating layers. The design includes through-holes filled with a filler, ensuring a flat interlaminar resin insulating layer on the substrate. The roughened layer on the conductor circuit pattern enhances crack resistance under heat cycle conditions, preventing damage to the cover plated layer. This innovation is crucial for improving the durability and functionality of electronic devices.

Career Highlights

Yoko Nishiwaki is currently employed at Ibiden Company Limited, where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in advancing the capabilities of printed wiring boards, making them more efficient and reliable for various applications.

Collaborations

Yoko has collaborated with Kouta Noda, a fellow innovator, to further enhance the development of their technologies. Their partnership has fostered a creative environment that encourages the exchange of ideas and expertise.

Conclusion

Yoko Nishiwaki's contributions to the field of printed wiring board technology exemplify his dedication to innovation. His patent for a multilayer printed wiring board showcases his ability to solve complex engineering challenges. Through his work at Ibiden Company Limited, he continues to push the boundaries of technology, making a lasting impact in the electronics industry.