Ogaki, Japan

Yoji Yanagawa

This inventor holds 1 USPTO granted patent. Top assignee: Ibiden Company Limited. Active years: 1993.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: The Innovations of Yoji Yanagawa

Introduction

Yoji Yanagawa is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring boards, particularly for integrated circuit (IC) cards. His innovative approach has led to advancements that enhance the reliability and functionality of these essential components.

Latest Patents

Yoji Yanagawa holds a patent for a printed wiring board designed specifically for IC cards. This invention relates to a printed wiring board that incorporates bumps formed in a part of the conductor circuit, which serve as external contact terminals. The design ensures that only the contact surfaces of these terminals are exposed on the surface of the IC card, maintaining a level plane with the over sheet. This innovation effectively prevents the IC module from springing out when the card is bent, thereby enhancing the electric contact reliability of the external terminals. He has 1 patent to his name.

Career Highlights

Yoji Yanagawa is associated with Ibiden Company Limited, where he has contributed to various projects involving advanced electronic components. His work has been instrumental in improving the design and functionality of IC cards, making them more efficient and reliable for users.

Collaborations

Yoji has collaborated with talented coworkers such as Atsushi Hiroi and Chiaki Nakanishi. Their combined expertise has fostered an environment of innovation and creativity within their projects.

Conclusion

Yoji Yanagawa's contributions to the field of printed wiring boards for IC cards exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing the reliability and performance of electronic components.

Profile summary based on public USPTO records.
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