Company Filing History:
Years Active: 2007
Title: Yoichi Abe: Innovator in Semiconductor Technology
Introduction
Yoichi Abe is a prominent inventor based in Yamato, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and solutions.
Latest Patents
Abe holds a patent for a semiconductor device featuring a unique electrode structure. This invention aims to prevent connection failures caused by the degradation of the connection interface strength of the electrode pad. The design includes a metal layer on the electrode pad and a metal bump made primarily of solder. Notably, the metal layer contains gold (Au), while the metal bump is composed of solder mainly made of tin (Sn). The average height of the bump is designed to be 100 micrometers or less per unit area on the electrode pad. Furthermore, the concentration of Au in the metal layer dissolved in the solder is set to 1.3×10 (Vol %) or less. The invention also suggests that the metal bump may contain palladium (Pd), and the solder coating is applied using a combination of dipping and paste printing techniques.
Career Highlights
Yoichi Abe is associated with Renesas Technology Corporation, where he continues to work on advancing semiconductor technologies. His expertise and innovative approach have positioned him as a valuable asset in the industry.
Collaborations
Abe collaborates with Shiro Yamashita, contributing to the development of cutting-edge semiconductor solutions.
Conclusion
Yoichi Abe's contributions to semiconductor technology through his innovative patent demonstrate his commitment to enhancing the reliability and performance of electronic devices. His work continues to influence the field and inspire future advancements.