The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Jun. 07, 2005
Shiro Yamashita, Fujisawa, JP;
Yoichi Abe, Yamato, JP;
Kenichi Yamamoto, Hino, JP;
Ryosuke Kimoto, Hamura, JP;
Hiroshi Kawakubo, Fussa, JP;
Shiro Yamashita, Fujisawa, JP;
Yoichi Abe, Yamato, JP;
Kenichi Yamamoto, Hino, JP;
Ryosuke Kimoto, Hamura, JP;
Hiroshi Kawakubo, Fussa, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 μm or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10(Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile