Yogendra Ranade

Title: Innovations by Inventor Yogendra Ranade

Introduction

Yogendra Ranade is a notable inventor based in Fremont, California. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on improving the performance and reliability of integrated circuits.

Latest Patents

One of his latest patents is titled "Method and apparatus for avoiding dicing chip-outs in integrated circuit die." This invention provides a method for forming a wafer that includes a plurality of integrated circuit die. It involves creating a saw street between the die to relieve cutting stress during the dicing process. Another significant patent is "Construction to improve thermal performance and reduce die backside warpage." This invention aims to enhance thermal performance in semiconductor packages by using a heatspreader with a preformed metal alloy. The process reduces die backside warpage, ensuring better contact with the heatspreader and improving overall thermal efficiency.

Career Highlights

Yogendra Ranade is currently employed at LSI Logic Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing technologies that enhance the performance of integrated circuits.

Collaborations

He has collaborated with notable coworkers such as Anand Govind and Rajagopalan Parthasarathy, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Yogendra Ranade's contributions to the field of semiconductor technology through his patents demonstrate his commitment to innovation and excellence. His work continues to impact the industry positively.