Uppsala, Sweden

Ylva Backlund

This inventor holds 3 USPTO granted patents. Top assignee: Telefonaktiebolaget Lm Ericsson (Publ). Active years: 1998-2000.


% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1998-2000

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3 patents (USPTO):Explore Patents

Title: Ylva Backlund: Innovator in Micro-Building-Block Technology

Introduction

Ylva Backlund is a notable inventor based in Uppsala, Sweden. She has made significant contributions to the field of micro-building-block technology, holding a total of 3 patents. Her work focuses on simplifying the handling and mounting of chips and chip-like structures.

Latest Patents

One of her latest patents is a method and device for positioning and retaining micro-building-blocks. This innovation aims to enhance the assembly of chips to work in conjunction with other micro-structures, such as micromechanical and microoptical elements. The retention of these micro-building-blocks is achieved through micromechanical tongues that act across holes in a carrier material, ensuring precise positioning and mechanical retention. Another significant patent involves a silicon substrate with a recess designed to hold an element in place, utilizing an integral holding element that extends over the recess.

Career Highlights

Ylva Backlund is currently employed at Telefonaktiebolaget LM Ericsson (Publ), a leading telecommunications company. Her work at Ericsson has allowed her to develop innovative solutions that contribute to advancements in technology.

Collaborations

Ylva collaborates with Hangkan Elderstig, who is also a prominent figure in the field. Their partnership fosters a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ylva Backlund's contributions to micro-building-block technology exemplify her innovative spirit and dedication to advancing the field. Her patents reflect her commitment to improving the efficiency and functionality of chip handling and mounting processes.

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