Telefonaktiebolaget Lm Ericsson (publ)

Ylva Backlund

Odd Steijer

Stefan Lindgren

Hangkan Elderstig

Carola Strandman

In order to simplify handling and mounting of chips or chip-like structures/micro-blocks, a method and a device have been developed, by which, depending on the area of use, one or more chips can be assembled to act together and/or act together with other chip-like structures such as micromechanical building elements or microoptical elements. The actual retention of a micro-building-block (1) is achieved by micromechanical tongues (4) acting across holes or cavities (2) in a carrier material (3). Silicon tongues can, for example, be both flexible and sufficiently strong to retain a chip. In this manner, there is assured both precise vertical and horizontal positioning and mechanical retention. Electrical connection to the chip can be effected either by thin film technology or by more conventional wire-bonding.

Method and device for positioning and retaining micro-building-blocks

In silicon substrate having a recess for receiving an element, at least one holding element, integral with the substrate, extends, at least partly, over the recess to hold an element received in the recess in place.

Silicon substrate having a recess for receiving an element

Optical components intended for telecommunications purposes must be manufactured and mounted with a great degree of accuracy, since a component, such as an optochip, when mounted must be coupled optically, electrically, mechanically and thermally at the same time. In order to obtain a right-angled geometry when using surface-emitting or surface-detecting components, and to obtain a reduced optical travel path and accurate fixation of an optofiber, a reflective surface (12) which slopes at an angle of 45 degrees is arranged between a light-conducting core (16) and the active surface (10) of an optochip, and the light-conducting core has been placed closer to the reflective surface by bevelling the optofiber (9) and fitting the fiber in a V-groove and accurately fixating the fiber in the groove by means of a flat cover means (20). The aforesaid solutions relate generally to problems of a geometrical nature, but are able to provide important advantages in the arrangement of optical components in so-called optical micro-structures in comparison with earlier known techniques with regard to requirements of space, signal transmission performances and manufacturing costs.

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Uppsala, Sweden

Ylva Backlund