This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Sandisk Technologies Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yiqin Huang: Innovator in Laser Cutting Technology
Introduction
Yiqin Huang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of laser cutting technology. His innovative approach addresses challenges associated with material re-deposition during the cutting process.
Latest Patents
Yiqin Huang holds 1 patent for his invention titled "Laser cutting with electron removal." This patent describes a laser cutting process designed to prevent undesired re-deposition of material onto the substrate. The process involves biasing at least one electrode to draw electrons from the plasma plume away from the substrate. Additionally, a vacuum port and/or blower is strategically placed to ensure gas flow away from the substrate, further directing electrons away. This innovative method significantly reduces the likelihood of material re-deposition.
Career Highlights
Yiqin Huang is currently employed at Sandisk Technologies Inc., where he continues to develop and refine his cutting-edge technologies. His work has garnered attention for its practical applications in various industries.
Collaborations
Yiqin collaborates with talented coworkers, including Cong Zhang and Hope Chiu. Their combined expertise contributes to the advancement of technology within their field.
Conclusion
Yiqin Huang's contributions to laser cutting technology exemplify the spirit of innovation. His patented process not only enhances efficiency but also addresses critical challenges in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
