The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jun. 10, 2022
Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventors:

Cong Zhang, Shanghai, CN;

Hope Chiu, Shanghai, CN;

Yiqin Huang, Shanghai, CN;

Guocheng Zhong, Shanghai, CN;

Weiting Jiang, Shanghai, CN;

Dongpeng Xue, Shanghai, CN;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); B23K 26/38 (2014.01); H10P 34/42 (2026.01); H10P 54/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0428 (2026.01); B23K 26/38 (2013.01); H10P 34/42 (2026.01); H10P 54/00 (2026.01);
Abstract

A laser cutting process for ensuring a plasma plume or cloud that forms during a substrate cutting process does not lead to undesired re-deposition of material onto the substrate. At least one electrode is biased to draw the electrons of the plasma plume or cloud towards the electrode and away from the substrate. A vacuum port and/or a blower may be strategically located to ensure gas flow away from the substrate and hence, directing of the electrons away from the substrate. In so doing, material re-deposition is less likely to occur.


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