Dongpeng Xue

Title: The Innovations of Dongpeng Xue

Introduction

Dongpeng Xue is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor wafer design.

Latest Patents

Dongpeng Xue holds a patent for a semiconductor wafer and semiconductor dies formed therefrom, which includes grooves along the long edges of the semiconductor dies. This patent describes a semiconductor wafer that includes semiconductor dies and laser grooves formed in the scribe lines along the long edges of the semiconductor dies. The laser groove extends between the long edges of two adjacent semiconductor dies to encompass the corners of the two adjacent semiconductor dies. When diced, the resulting semiconductor dies have portions of the corners removed. This innovation enhances the efficiency and performance of semiconductor devices.

Career Highlights

Dongpeng Xue is currently employed at SanDisk Technologies Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor manufacturing.

Collaborations

He has collaborated with talented coworkers, including Chin-Tien Chiu and Jia Tao Li, to further enhance the innovations in their field.

Conclusion

Dongpeng Xue's contributions to semiconductor technology through his patent and work at SanDisk Technologies Inc. highlight his role as a key innovator in the industry. His advancements are paving the way for future developments in semiconductor applications.