This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Ndtm US LLC. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Yingming Liu in 3D NAND Technology
Introduction
Yingming Liu is a notable inventor based in Liaoning, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of 3D NAND memory solutions. His innovative work has led to the filing of a patent that enhances the performance and reliability of memory devices.
Latest Patents
Yingming Liu holds a patent for an invention titled "Additional silicide layer on top of staircase for 3D NAND WL contact connection." This patent describes an apparatus that includes a substrate, a memory array of vertical 3D NAND strings formed in the substrate, and a staircase region. The invention features a polysilicon wordline that extends horizontally into the staircase region, along with a wordline contact that extends vertically through the staircase region to establish electrical contact with the polysilicon wordline. Additionally, a punch stop layer is disposed between the wordline contact and the polysilicon wordline. This innovative design aims to improve the efficiency and functionality of 3D NAND technology.
Career Highlights
Yingming Liu is currently employed at Intel Ndtm US LLC, where he continues to work on advancing semiconductor technologies. His expertise in 3D NAND memory has positioned him as a valuable asset to the company. Liu's contributions are instrumental in driving innovation within the organization and the industry as a whole.
Collaborations
Yingming Liu collaborates with fellow inventor Junchao Ding, with whom he shares insights and expertise in the field of semiconductor technology. Their partnership fosters a creative environment that encourages the development of groundbreaking solutions.
Conclusion
Yingming Liu's work in 3D NAND technology exemplifies the spirit of innovation in the semiconductor industry. His patent and ongoing contributions at Intel Ndtm US LLC highlight his commitment to advancing technology and improving memory solutions. Liu's achievements serve as an inspiration for future inventors in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile