Ying-Tsung Chu

Title: Ying-Tsung Chu: Innovator in Semiconductor Technology

Introduction

Ying-Tsung Chu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on innovative solutions that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Ying-Tsung Chu's latest patents include a wafer structure that features probe marked test pads. This invention provides a wafer structure and a manufacturing method that includes a substrate structure, a first dielectric layer, multiple test pads, a second dielectric layer, and multiple bond pads. The design ensures that each bond pad does not overlap the probe mark of the corresponding test pad, optimizing the manufacturing process. Another notable patent is a semiconductor bonding structure that involves a first chip and a second chip bonded together. This structure utilizes copper bonding pads and a heterogeneous contact combination, which includes a contact stack of copper, tungsten, and aluminum elements.

Career Highlights

Ying-Tsung Chu is currently employed at Powerchip Semiconductor Manufacturing Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Ying-Tsung Chu has collaborated with notable colleagues such as Chun-Lin Lu and Shou-Zen Chang. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Ying-Tsung Chu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the advancement of semiconductor manufacturing processes and technologies.