Ying-Tang Su

Title: Innovations of Ying-Tang Su in Ball Grid Array Technology

Introduction

Ying-Tang Su is a notable inventor based in Longtan, Taiwan. He has made significant contributions to the field of electronic packaging, particularly in the development of ball grid array (BGA) technology. His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.

Latest Patents

Ying-Tang Su holds a patent for a "Ball grid array and land grid array having modified footprint." This invention includes an apparatus with a substrate featuring a surface and a plurality of solder balls arranged to form a ball grid array. A portion of these solder balls is designed to have a specific pitch between adjacent solder balls, which are shaped like truncated spheres. Additionally, at least one solder ball is included in a solder island on the surface, differing in shape from the truncated sphere. This innovation is crucial for improving the efficiency of electronic connections.

Career Highlights

Ying-Tang Su is currently employed at Omnivision Technologies, Inc., where he continues to push the boundaries of technology in the field of electronic packaging. His work has been instrumental in developing solutions that meet the growing demands of modern electronics.

Collaborations

Throughout his career, Ying-Tang Su has collaborated with talented professionals, including Wei-Feng Lin and Kah-Ong Tan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ying-Tang Su's contributions to ball grid array technology exemplify the impact of innovative thinking in the electronics industry. His patent and ongoing work at Omnivision Technologies, Inc. highlight his commitment to advancing technology and improving electronic device performance.