The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Nov. 27, 2012
Applicant:
Omnivision Technologies, Inc., Santa Clara, CA (US);
Inventors:
Assignee:
OmniVision Technologies, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 13/04 (2006.01); H05K 3/34 (2006.01); H04N 5/225 (2006.01); H01L 27/146 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 23/49838 (2013.01); H01L 27/14618 (2013.01); H04N 5/2257 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01); H05K 1/111 (2013.01); H05K 2201/094 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/613 (2015.11); Y10T 29/49144 (2015.01);
Abstract
An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.