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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wei-Feng Lin

USPTO Granted Patents = 67 


Average Co-Inventor Count = 2.7

ph-index = 9

Forward Citations = 321(Granted Patents)


Inventors with similar research interests:


Location History:

  • Zhudong Township, Hsinchu County, TW (2019)
  • Hsinchu County, TW (2021 - 2022)
  • Hsin-Chu, TW (2000 - 2024)

Company Filing History:

goldMedal48 out of 1,354 
 
Omnivision Technologies, Inc.
 patents
silverMedal19 out of 293 
 
Silicon Integrated Systems Corporation
 patents

Years Active: 2000-2025

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67 patents (USPTO):Explore Patents
1. 12251081 - Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes (2025-03-18),
2. 12064090 - Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs (2024-08-20),
3. 12062673 - Apparatus and method for curved-surface image sensor (2024-08-13),
4. 11973098 - Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same (2024-04-30),
5. 11943525 - Electronic camera module with integral LED and light-pipe illuminator (2024-03-26),
6. 11626434 - Image sensor package (2023-04-11),
7. 11583171 - Surface-mount device platform and assembly (2023-02-21),
8. 11562928 - Laser marked code pattern for representing tracing number of chip (2023-01-24),
9. 11520197 - Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture (2022-12-06),
10. 11515347 - Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same (2022-11-29),
11. 11404844 - Semiconductor structure and method of manufacturing the same (2022-08-02),
12. 11320663 - Diffractive optical elements made of conductive materials (2022-05-03),
13. 11211414 - Image sensor package (2021-12-28),
14. 11172806 - Medical micro-cable structure and connection method with mini camera cube chip (2021-11-16),
15. 11114483 - Cavityless chip-scale image-sensor package (2021-09-07),

Title: The Innovative Journey of Wei-Feng Lin

Introduction: Wei-Feng Lin, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Wei-Feng Lin holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence. His most recent patent focuses on a revolutionary method for enhancing solar cell efficiency through nanotechnology.

Career Highlights: With a background in electrical engineering, Wei-Feng Lin has worked for top technology companies in Taiwan, where he honed his skills in research and development. His innovative spirit led him to establish his own tech startup, where he continues to push the boundaries of technological advancement.

Collaborations: Wei-Feng Lin has collaborated with leading research institutions in Taiwan and internationally to further his inventions. His partnerships with universities and tech companies have resulted in cutting-edge technologies that have the potential to shape the future of various industries.

Conclusion: Wei-Feng Lin's relentless pursuit of innovation and his passion for creating solutions to complex technological challenges have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire the next generation of inventors and pave the way for a more technologically advanced future.

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