St. Louis, MO, United States of America

Ying Shi

This inventor holds 8 USPTO granted patents and 6 published patent applications and 3 EPO patents. Top assignee: The Boeing Company. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ying Shi. Retrieved from https://idiyas.com/inventor/ying-shi-8tj8474m

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.7

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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8 patents (USPTO):Explore Patents

Title: Ying Shi - Innovator in Thermoplastic Technology

Introduction

Ying Shi is a notable inventor based in St. Louis, MO, who has made significant contributions to the field of thermoplastic technology. With a focus on innovative materials, he has developed a unique patent that enhances the performance of thermoplastic substrates.

Latest Patents

Ying Shi holds a patent for "Thermoplastic films and methods for coating thermoplastic substrates with thermoset materials." This invention involves a thermoplastic composition that includes a thermoplastic polymer and a polyaryletherketone polymer, which are mixed to improve the properties of thermoplastic materials.

Career Highlights

Ying Shi is currently employed at The Boeing Company, where he applies his expertise in materials science to advance aerospace technologies. His work is instrumental in developing new materials that can withstand the demanding conditions of flight.

Collaborations

Ying has collaborated with talented colleagues such as Timothy J. Luchini and Marcos Pantoja, contributing to a dynamic team focused on innovation and excellence in engineering.

Conclusion

Ying Shi's contributions to thermoplastic technology exemplify the spirit of innovation in the aerospace industry. His work not only enhances material performance but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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