The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Feb. 02, 2022
The Boeing Company, Chicago, IL (US);
Ying Shi, Saint Louis, MO (US);
Alexander M. Rubin, St. Louis, MO (US);
Gregory J. Hickman, University City, MO (US);
The Boeing Company, Arlington, VA (US);
Abstract
A method for joining a first thermoplastic substrate and a second thermoplastic substrate, each including a polyaryletherketone material having a first melting temperature. The method includes co-consolidating a first semicrystalline thermoplastic film with the first thermoplastic substrate to yield a first co-consolidated structure. The first semicrystalline thermoplastic film defines a first bonding surface of the first co-consolidated structure and includes a polyaryletherketone material having a second melting temperature that is less than the first melting temperature. The method further includes co-consolidating a second semicrystalline thermoplastic film with the second thermoplastic substrate to yield a second co-consolidated structure. The second semicrystalline thermoplastic film defines a second bonding surface of the second co-consolidated structure and includes a polyaryletherketone material having a third melting temperature that is less than the first melting temperature. The method further includes fusing the first bonding surface to the second bonding surface. The method yields a stacked structure.