Company Filing History:
Years Active: 2018-2019
Title: Innovations of Ying-Lien Chen
Introduction
Ying-Lien Chen is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of interconnect structures, holding a total of 3 patents. His work is recognized for its innovative approaches to enhancing the performance and reliability of electronic components.
Latest Patents
Ying-Lien Chen's latest patents focus on advanced interconnect structures. One of his patents describes an interconnect structure that includes a dielectric layer and a conductor embedded within it. The top surface of the conductor is designed to be flush with the top surface of the dielectric layer. Additionally, a cobalt cap layer is deposited on the top surface of the conductor, followed by a nitrogen-doped cobalt layer on the cobalt cap layer. This innovative design aims to improve the efficiency and functionality of electronic devices.
Career Highlights
Ying-Lien Chen is currently employed at United Microelectronics Corporation, a leading semiconductor foundry. His work at the company has allowed him to collaborate with other talented professionals in the field, contributing to the advancement of semiconductor technology.
Collaborations
Some of his notable coworkers include Ko-Wei Lin and Hung-Miao Lin. Their collaborative efforts have further enhanced the innovative projects undertaken at United Microelectronics Corporation.
Conclusion
Ying-Lien Chen's contributions to the field of interconnect structures demonstrate his commitment to innovation and excellence in semiconductor technology. His patents reflect a deep understanding of the complexities involved in electronic design, making him a valuable asset to the industry.