Midland, MI, United States of America

Ying-Hung So


Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 1985-2003

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4 patents (USPTO):Explore Patents

Title: The Innovations of Ying-Hung So: A Pioneer in Printed Wiring Board Technology

Introduction: Ying-Hung So, a talented inventor based in Midland, MI, has made significant contributions to the field of materials science, particularly in the development of advanced polymers for printed wiring boards. With four patents to his name, So's work showcases his dedication to innovation and the practical application of complex chemical materials in technology.

Latest Patents: Among his notable inventions, Ying-Hung So's latest patents focus on toughened benzocyclobutene-based polymers. These polymers are specifically designed for building-up printed wiring boards, utilizing metal foil coated with dielectric polymers that offer enhanced toughness and durability. The patents describe a novel process that incorporates benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additives, and optional photoactive compounds. Such advancements not only improve the performance of printed wiring boards but also contribute to the overall reliability of electronic devices.

Career Highlights: Ying-Hung So has had a distinguished career, working with prominent organizations such as The Dow Chemical Company and Dow Global Technologies LLC. His expertise in polymer chemistry and materials engineering has enabled him to develop innovative solutions that address industry challenges. His focus on creating effective applications for advanced materials positions him as a key figure in the realm of modern technology.

Collaborations: Throughout his career, So has collaborated with esteemed colleagues, including Kaoru Ohba and Hideki Akimoto. These collaborations have facilitated the exchange of ideas and concepts, further driving innovation within their projects.

Conclusion: Ying-Hung So's work exemplifies the spirit of innovation in the field of materials science. With a solid foundation of patents and a commitment to improving technology, he continues to influence the development of printed wiring boards and related applications. His contributions not only advance the field but also demonstrate the importance of collaborative efforts in driving technological progress.

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