The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2002
Filed:
Feb. 02, 2000
Applicant:
Inventors:
Kaoru Ohba, Mishima, JP;
Brian Martin, Ashburn, VA (US);
Hideki Akimoto, Susono, JP;
Albert Charles Marie Achen, Haguenau, FR;
Philip E. Garrou, Cary, NC (US);
Britton Lee Kaliszewski, Saginaw, MI (US);
Ying-Hung So, Midland, MI (US);
Assignee:
The Dow Chemical Company, Midland, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 ;
U.S. Cl.
CPC ...
G03F 7/00 ;
Abstract
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.