This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Ying-Chen Sun: Semiconductor Packaging Inventor
Introduction
Ying-Chen Sun is an inventor based in Ciaotou, Taiwan. His patent work includes semiconductor packaging technology developed during his association with Advanced Semiconductor Engineering, Inc.
Latest Patents
Sun is credited with 1 patent, titled “Leadframe with Die Pad.” The invention describes a leadframe with a die pad, surrounding leads, tie bars connected to the die pad’s corners, and metal extrusions attached to its sides. The extrusions are separated from the tie bars and feature locking holes and raised bonding surfaces. They are designed to improve ground connections through wire bonding and help secure an exposed die pad in a semiconductor package without transmitting stress.
Career Highlights
Sun’s patent focuses on leadframe design and the mechanical and electrical considerations involved in semiconductor packaging. The disclosed features address ground bonding and die-pad stability when the package encapsulant leaves the die pad’s bottom surface exposed.
Collaborations
Sun is associated with Advanced Semiconductor Engineering, Inc. His listed coworkers include Kang-Wei Ma and Shu-Chen Yang.
Conclusion
Ying-Chen Sun’s patent presents a leadframe design intended to improve wire-bonded ground connections while helping stabilize an exposed die pad in semiconductor packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile